CLEANTHROUGH 750J
Liquid
0.95(25℃)
9.5(25℃)
High density IC package, BGA, CSP, WLCSP, PIP, POP.
Deflux cleaner. Cleaner for rosin based solder paste and flux with excellent penetration and high speed solubility. Developed for key compositional change of Pb free solder and flux by RoHS compatible, higher Sn salt solubility. Ideal for high density IC substrate and package.
Asia
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